Job at a glance
Job Title: Mechanical Engineer Job Description This Mechanical Engineer role focuses on the design and development of high‑density optical transceiver modules and advanced photonic packaging. You will work at the intersection of mechanical engineering, heat transfer, advanced materials, and manufacturability to create extremely compact, layered assemblies that integrate photonic components, microprocessors, and precision interconnects.
The position requires strong mechanical design skills, creativity, and a deep understanding of both mechanical and photonic integration to deliver scalable, high‑performance solutions for next‑generation connectivity. Responsibilities Design high‑density PCB enclosures and mechanical assemblies for compact optical transceiver modules using 3D CAD tools such as CREO or SolidWorks. Develop mechanical architectures for multilayer, vertically stacked modules that integrate photonic components, optical fibers, microprocessors, and precision interconnects.
Apply thermal management principles to ensure reliable operation of densely packed modules, including heat transfer analysis and implementation of effective cooling strategies. Incorporate design for manufacturability (DFM) principles into all designs to enable efficient, scalable production of high‑complexity products. Perform tolerance analysis and apply geometric dimensioning and tolerancing (GD&T) to ensure precise fit, function, and assembly of mechanical components.
Use key development tools such as 3D CAD and finite element analysis (FEA) to validate mechanical performance, structural integrity, and thermal behavior. Conduct interference checks and verify mechanical clearances within high‑density assemblies to prevent conflicts and ensure robust integration. Support new product development activities from concept through production, including design iterations, prototyping, testing, and design refinement.
Assess project requirements, identify and articulate technical risks, and develop project milestones within a structured stage‑gate (PLCQ) process. Lead mechanical engineering projects involving multiple engineers, coordinating tasks and ensuring alignment with technical and schedule objectives. Organize and lead cross‑functional and mechanical design reviews to gather feedback, resolve issues, and drive design decisions.
Mentor less experienced engineers by sharing best practices, reviewing designs, and providing technical guidance in mechanical design and analysis. Collaborate with global, cross‑functional teams including engineering, manufacturing, and supply chain to ensure designs meet performance, reliability, and manufacturability goals. Ensure compliance with applicable industry, sector‑specific, regulatory, and safety standards in all mechanical designs and documentation.
Contribute to continuous improvement by influencing others, standardizing best practices, and supporting scalable, sustainable engineering solutions. Essential Skills At least 5 years of experience designing high‑density PCB enclosures using 3D CAD tools such as CREO or SolidWorks. Strong proficiency in mechanical design for compact, multilayer assemblies and complex electromechanical modules. Hands‑on experience with thermal management and heat transfer for densely integrated electronic and photonic systems.
Demonstrated expertise in design for manufacturability (DFM) for high‑complexity mechanical products. Proficiency in geometric dimensioning and tolerancing (GD&T) and tolerance analysis for precision mechanical assemblies. Experience with new product development and mechanical engineering projects in telecom or related high‑technology industries. Detailed knowledge of industry or sector‑specific regulatory and safety standards relevant to mechanical design.
Broad experience developing high‑complexity projects requiring mechanical engineering design specializations such as tolerance analysis, DFM, and serviceability. Proficiency with key development tools incl