Process & Application Engineer (Die-Bonding / Thermo Compression Bonding / Visual inspection)

Key Responsibilities Process Setup: Program and optimize die-attach, eutectic, and thermo-compression bonding equipment. Application Engineering: Evaluate customer requirements, run feasibility studies, and manage sample fabrication for New Product Introduction (NPI). Quality & Inspection: Set up Automated Optical Inspection (AOI) programs and establish criteria to detect defects (voids, tilt, misalignment).

Yield Improvement: Use DOE and SPC to resolve process variations, perform root-cause failure analysis, and write SOPs. Required Qualifications Education: Degree in Mechanical, Electrical, Materials Engineering, or related fields. Experience: 2+ years in semiconductor packaging or microelectronics assembly. Technical Skills: Hands-on experience programming bonding equipment and automated vision/inspection systems.

Tools: Familiarity with failure analysis (shear testing, X-ray) and statistical software (Minitab/JMP).