Software Engineer (Semicon, MNC)

Key Responsibilities Design and develop machine control systems, software, and hardware for die and wire bonding equipment. Perform software-hardware integration, testing, qualification, and documentation. Analyze customer requirements and develop suitable solutions and modifications. Provide technical support and troubleshooting for customers. Define software development processes and engineering standards.

Plan and manage technical projects to meet quality and timeline requirements. Develop engineering documentation, SOPs, and guidelines. Job Requirements Degree in Electronics, Electrical, or Mechatronics Engineering (Second Upper or above). Strong in software programming and electrical/electronics design for die and wire bonding machines. Proficient in Visual C++, C#, and VB.NET. Strong semiconductor process knowledge.

Excellent technical leadership, analytical, and problem-solving skills. Self-motivated, innovative, and able to work independently and in teams. Willing to learn and take on new challenges. For interested applicants, kindly send your resume in Word/PDF format to include the following in your resume including: 1. Current Salary 2. Expected Salary 3. Availability 4. Reason for leaving Thank you for your application and we regret that only shortlisted applicants will be notified By submitting any application or resume to us, you will be deemed to have agreed & consented to us collecting, using, retaining & disclosing your personal information to prospective employers with the services provided by us.

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