Job at a glance
The Emerging Packaging Technologies at Texas Instruments is looking for a candidate for Inductor and Power module development engineer Responsibilities: Design and develop ultra-compact, high-density, high current (100–300A) power delivery modules targeting enterprise and AI infrastructure applications. Understand market trends and end equipment system requirements and translate these into package design specifications.
Work with magnetic material and component suppliers to evaluate and qualify materials, inductors, and capacitors that meet performance, reliability, and scaling requirements. Ensure manufacturability, testability, and reliability through evaluation, material qualification, and supplier collaboration. Collaborate with cross-functional teams across sites to support development schedules and time-to-market targets.
Minimum Qualifications: MS degree in Electrical Engineering, Materials Science, or related field with focus on magnetics and power packaging. 5+ years of hands-on experience in inductor design or package development. Working knowledge of power delivery architectures, thermal management, EMI, and reliability constraints. Good understanding of magnetic material types. Familiarity with material characterization techniques (BH analyzer, VSM, SEM, EDX).
Understanding of material processing for ceramic, metal powder, and composite materials. Familiarity with inductor coil forming and termination processes: wire wound, multilayer, metal composite, thin film, etc. Good communication skills; able to work effectively with internal teams and external suppliers. Proficiency in English and Japanese. Preferred Qualifications: Hands-on experience with simulation tools such as Maxwell, Ansys, or Femtet; familiarity with homogenization, model order reduction, and optimization techniques (NN, AI/ML a plus).
Prior contributions to patents or publications in magnetics, packaging, or passive integration. Familiarity with magnetic supplier capabilities and emerging research directions.